Précédent
Suivant
Brevet : EP2587529 - APPAREIL D'ASPIRATION, ET DISPOSITIF ET PROCÉDÉ POUR L'OBSERVATION D'UN DISPOSI...
Titre
APPAREIL D'ASPIRATION, ET DISPOSITIF ET PROCÉDÉ POUR L'OBSERVATION D'UN DISPOSITIF SEMI-CONDUCTEUR
N° et date de publication de la demande
EP2587529 - 01/05/2013
Type de la demande
A1
N° et date de dépôt
EP11798145.6 - 21/06/2011
N° et date de priorité
JP2010142868 - 23/06/2010
Classification CIB
Classification CPC
H01L 21/6838 ; H01L 21/68757 ; H01L 21/68785 ; H01L 22/12 ; G01N 21/9501 ; G01N 21/9501 ; H01L 21/6838 ; H01L 21/68757 ; H01L 21/68785 ; H01L 22/12 ; H01L 22/24 ; H01L 21/6838 ; H01L 21/68757 ; H01L 21/68785 ; H01L 22/12 ; G01N 21/01 ; G01N 21/9501
Famille de brevets
WO2011162261A1 ; US2013088714A1 ; CN102947922A ; KR20130083826A ; EP2587529A1 ; TW201214595A ; JPWO2011162261A1
Abrégé
A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W formed with a semiconductor device D is arranged and a second surface 14 that is a surface opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 onto which light from the semiconductor device D is made incident and a light emitting surface 17 from which light made incident from the light incident surface 16 is emitted, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed.
INTERVENANTS
Déposant
HAMAMATSU PHOTONICS K.K. - 1126-1, ICHINO-CHO HIGASHI-KU HAMAMATSU-SHI, SHIZUOKA 435-8558 - JP
Titulaire
HAMAMATSU PHOTONICS K.K. - 1126-1, ICHINO-CHO HIGASHI-KU HAMAMATSU-SHI, SHIZUOKA 435-8558 - JP
Inventeur
TERADA HIROTOSHI HAMAMATSU-SHI, SHIZUOKA 435-8558 - JP
MATSUURA HIROYUKI HAMAMATSU-SHI, SHIZUOKA 435-8558 - JP
Mandataire
HOFFMANN EITLE - PATENT- UND RECHTSANWALTE PARTMBB ARABELLASTRASSE 30 81925 MUNCHEN - DE
STATUT EN FRANCE : Déchu
Délivrance
17/01/2018
Registre national des brevets (RNB)
28/07/2023 - N°0258184 - OO : Dérogation à la compétence de la Juridiction Unifiée du Brevet (BOPI 2023-36)
Date de constatation de déchéance
-
04/03/2019 (BOPI 2019-14)
Date de paiement de la prochaine annuité
02/07/2018
