Brevet : EP0928486 - DISPOSITIF ET PROCEDE D'ESSAI DES DES D'UN CIRCUIT INTEGRE DANS UN MODULE DE CI...

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Titre

DISPOSITIF ET PROCEDE D'ESSAI DES DES D'UN CIRCUIT INTEGRE DANS UN MODULE DE CIRCUIT INTEGRE

N° et date de publication de la demande

EP0928486 - 14/07/1999

Type de la demande

A1

N° et date de dépôt

EP97938416.1 - 20/08/1997

N° et date de priorité

US71817396 - 19/09/1996

Abrégé

An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable pads to one of the MCM's reference voltage pins. By applying a supply voltage to the test mode enable pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a reference voltage applied to the test mode enable pads through the reference voltage pins and the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing, includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.

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INTERVENANTS

Déposant

MICRON TECHNOLOGY INC (MICRON TECHNOLOGY, INC.) - US

Titulaire

MICRON TECHNOLOGY, INC.

Inventeur

FARNWORTH WARREN M (FARNWORTH, WARREN, M.) - US

WARK JAMES M (WARK, JAMES, M.) - US

NELSON ERIC S (NELSON, ERIC, S.) - US

DUESMAN KEVIN G (DUESMAN, KEVIN, G.) - US

Mandataire

V.O. PATENTS & TRADEMARKS - PO BOX 87930 2508 DH THE HAGUE - NL

STATUT EN FRANCE : Brevet EP sans effet

Délivrance

14/11/2001

Non remise de traduction du brevet

27/09/2002 (BOPI 2002-39)

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